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Ceramic PCB Process capability
No.ItemCapability
1Material Al2O3   AIN  Si3A4 
2Thermal conductivity Al2O3 22.3-29.5w/m.K  AIN :170w/m.K  Si3A4 :85w/m.K
3Dielectric constant (1MHz)  Al2O3 9.5/9.8  AIN :9       Si3A4 :7.8
4Material thickness

0.2/0.25/0.3/0.38/0.5/0.635

/0.8/1.0/1.2/1.5 (mm)

4Material specification

50.5*50.5/80*50.5/120*120*

/127*127/132*142/140*190 (mm)

5The Number of  layers1layer  or 2 layers
6Min hole diameter0.08mm
7Hole location accuracy0.025mm
8Min pattern width/spacing0.075mm/0.04mm
9Finished copper thickness0.5oz/1oz/2oz/4oz/8oz/12oz
10Filling hole aspect ratio9:1
11Metal surround dam 50-1000 um
12Surface treatment: ENIG  Au0.025-0.1um    Ni3-7um
13Surface treatment: Immersion silversilver: 0.2-0.5um
14Surface treatment: Immersion tintin: 0.2-1um
15Surface treatment: OSP 2-5u"
16Surface treatment: Immersion NiPdAuAu:0.025-1um    Pd:0.025-0.075um    Ni:3-7um
17Laser outline tolerance±0.10mm   (special) ±0.05mm
SUNBRIGHT PCB TECHNOLOGY (HK)
 
Tel:+86-755-29753506   +86-755-81774121
E-mail: sales@sunbrightpcb.com
Headquarters Address:Room 405-406, Building 1, No. 62, Yongnan Road, Shajing Town, Bao'an District, Shenzhen
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