Rigid-Flex PCB Process capability |
No. | Item | Capability |
1 | FPC Main material | Brand:taiflex、graceth、SY |
2 | PCB Material | Brand:SY、ITEQ、KB、NP |
3 | Texture | PI、 PET |
4 | Cover Film | Brand:taiflex、graceth、SY |
5 | Max Layers | 16layers(sample)、12layers(manufacture) |
6 | Finish Board thickness | 0.25-6.0 mm |
7 | Min Pattern Width / Spacing | 0.05mm/0.05mm |
8 | Max finished product size | 230*450mm |
9 | Finished Board thickness tolerance | ±0.05mm |
10 | PP Thickness | 12.5um 、 25um 、 50um |
11 | Copper thickness | 12um 、 18um 、 36um 、 70um |
12 | Stiffener materail | FR4/PI/PET/SUS/PSA |
13 | Surface treatment | ENIG、Immersion tin、OSP、immersion silver、plating gold |
14 | Min hole size | Mechanical Hole :0.15mm 、Laser Hole0.1mm |
15 | Hole tolerance | NPTH:±0.05mm 、PTH:±0.075mm |
16 | Cover film color | Yellow 、 Black、White、Transparent |
17 | PI thickness | 0.5mil、0.7mil、0.8mil、1mil、2mil |
18 | Max number of layers of FPC | 8 layers |
19 | Min finished size | 5mm*8mm |
20 | Min pad | inner layer(5mil)、outer layer(4mil) |
21 | Stiffener min size | 4mm×5mm |
23 | Stifferner alignment accuracy | ±0.075mm |
24 | Cover minimum openning size | 0.6×0.6mm(steeling tooling)、0.5×0.5mm(Precision tooling) |
25 | Minimum openning spacing for covering film | 0.5mm(Precision tooling)、0.2mm(Laser Routing)、 0.15mm(Normal drilling) |
26 | Coating film overflow amount(unilateral) | Normal0.08-0.12mm 、 Limitation0.03mm |
27 | Min diameter of gold finger semicircle hole | 0.25mm,Normal value0.3mm |
28 | Rigid-Flex PCB:Peel-off strength | 1.4N |
29 | Rigid-Flex PCB:Planeness | Less than 15um before baking; less than 30um after baking |
30 | Rigid-Flex PCB:thermal shock | 288℃(3 times within 10 seconds) |
31 | Rigid-Flex PCB:W/B gold wire pull | > 6g |
32 | Rigid-Flex PCB:Min board thickness | FPCB:0.1mm、4Layers:0.3mm 、6Layers:0.5mm、8Layers:0.6mm、10Layers:0.8mm |