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HDI PCB Process capability
No.ItemCapability
1MaterialBrand:SY、ITEQ、KB、NP 
2Construction N+N、N+X+N、1+(N+X+N)+1
3Layer4-40Layers
4Min Pattern Width / Spacing2/2mil
5Min Mechanical Hole0.15mm
6Min Thickness of Core Board2mil
7Laser Hole0.05-0.1mm
8Min thickness of PP2mil
9Max diameter of resin plug hole0.5mm
10Electroplating to fill holes0.15mm
11The distance from the wall of via to the pattern6mil
12Laser drilling hole accuracy±0.025mm
13Min BGA pad center distance0.3mm
14Back drilled/countersink hole tolerance±0.05mm
15Through-hole plating penetration capacity16:1(Thickness to aperture ratio)
16Blind hole plating penetration capacity1.5:1(Thickness to aperture ratio)
17BGA min PAD0.15mm
18Min Buried Hole(Mechanical Hole)0.15mm
19Min Buried Hole(Laser Hole)0.05mm
20Min Blind Hole(Laser Hole)0.05mm
21Min Blind Hole(Mechanical Hole)0.15mm
22Minimum spacing between laser blind hole and mechanical buried hole0.2mm
23Interlaminar alignment±0.05mm
SUNBRIGHT PCB TECHNOLOGY (HK)
 
Tel:+86-755-29753506   +86-755-81774121
E-mail: sales@sunbrightpcb.com
Headquarters Address:Room 405-406, Building 1, No. 62, Yongnan Road, Shajing Town, Bao'an District, Shenzhen
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