HDI PCB Process capability |
No. | Item | Capability |
1 | Material | Brand:SY、ITEQ、KB、NP |
2 | Construction | N+N、N+X+N、1+(N+X+N)+1 |
3 | Layer | 4-40Layers |
4 | Min Pattern Width / Spacing | 2/2mil |
5 | Min Mechanical Hole | 0.15mm |
6 | Min Thickness of Core Board | 2mil |
7 | Laser Hole | 0.05-0.1mm |
8 | Min thickness of PP | 2mil |
9 | Max diameter of resin plug hole | 0.5mm |
10 | Electroplating to fill holes | 0.15mm |
11 | The distance from the wall of via to the pattern | 6mil |
12 | Laser drilling hole accuracy | ±0.025mm |
13 | Min BGA pad center distance | 0.3mm |
14 | Back drilled/countersink hole tolerance | ±0.05mm |
15 | Through-hole plating penetration capacity | 16:1(Thickness to aperture ratio) |
16 | Blind hole plating penetration capacity | 1.5:1(Thickness to aperture ratio) |
17 | BGA min PAD | 0.15mm |
18 | Min Buried Hole(Mechanical Hole) | 0.15mm |
19 | Min Buried Hole(Laser Hole) | 0.05mm |
20 | Min Blind Hole(Laser Hole) | 0.05mm |
21 | Min Blind Hole(Mechanical Hole) | 0.15mm |
22 | Minimum spacing between laser blind hole and mechanical buried hole | 0.2mm |
23 | Interlaminar alignment | ±0.05mm |