图片展示
Common PCB Process capability
No. Item Capability
1 Number of layer 1-20
2 Material Brand:   SY, ITEQ, KB, NanYa,  NP , GDM,  Isola  
3 Surface treatment HASL lead-free, ENIG, OSP, Immersion Tin, Immersion Silver, Plating Gold
4 Selectivity surface treatment ENIG+OSP, ENIG+G/F, Flash Gold+G/F, Immersion Silver+G/F, Immersion Tin+G/F
5 Solder mask color Green, Yellow, Black, Matte black, Blue, Red, White,Matte green
6 Silkscreen color White, Yellow, Black
7 Max board size (4-10 layers) 800*600mm
8 Min outline tolerance ±0.03mm(Laser Routing),      ±0.1mm(Mechanical Routing)
9 Finished Board Thickness 0.15-5mm
10 The tolerance of board thickness ±0.1mm(thickness≤1.0mm), ±10%mm(thickness>1.0mm)
11 Min Drilling hole size  0.2mm(Mechanical)
12 Min hole tolerance NPTH:±0.025mm             PTH: ±0.05mm
13 Min Slot hole width/length 0.5mm/1.0mm
14 Min pattern width/spacing 0.075mm/0.075mm (35um base copper)
15 Min pad 0.15mm
16 FR-4 PP 106, 1080, 3313, 2116, 7628
17 Min inner layer isolation width 8mil
18 Min inner layer isolation ring 8mil(6layer), 10mil(8layer)
19 Min single side width of inner pad  4.5(18, 35um, Can be partial 4), 6(70um), 8(105um)
20 Impedance tolerance ±5Ω(50Ω), ±10%(50Ω);
21 Min BGA pad diameter 6mil
22 ENIG  thickness Gold0.025-0.10um     Nickel3-5 um
23 Immersion silver.silver thickness normal0.2-0.5um    (special)1um
24  HASL Lead Free thickness 2-4um
25 Gold Finger:gold/nickel thickness 0.075-2.5um /3-5um
26 Flash Gold:gold thickness 0.025-0.05um
27 Golden finger chamfer Angle tolerance ±5°
28 Immersion tin:Tin thickness 0.8-1.5um
29 Electroplate hard gold thick 0.075-2.5um 
30 Min S/M bridge width 3(green), 5(other color)(base copper10Z)(base coppe2-40Z, All in accordance with the 8mil)
31 Max diameter of ink plug hole 0.55mm
32 V-CUT Angle specifications 15°20°25°30°
33 Min isolation between carbon and pad 0.2mm
34 Min isolation between carbon and carbon 0.3mm
35 Depth control slot hole
( edge) or Blind slot precision(NPTH)
±0.10mm
36 Min. distance from hole to trace (Not blind/buried holes) 6(8layers), 8(14layers), 9(20layers)
37 Min single-sided width for via hole pad of outer layer 4(12, 18um)3.5, 4.5(35um), 6(70um), 8(105um), 10(140um)
38 Copper stripping strength 7.8N/cm
SUNBRIGHT PCB TECHNOLOGY (HK)
 
Tel:+86-755-29753506   +86-755-81774121
E-mail: sales@sunbrightpcb.com
Headquarters Address:Room 405-406, Building 1, No. 62, Yongnan Road, Shajing Town, Bao'an District, Shenzhen
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