Common PCB Process capability | ||
No. | Item | Capability |
1 | Number of layer | 1-20 |
2 | Material | Brand: SY, ITEQ, KB, NanYa, NP , GDM, Isola |
3 | Surface treatment | HASL lead-free, ENIG, OSP, Immersion Tin, Immersion Silver, Plating Gold |
4 | Selectivity surface treatment | ENIG+OSP, ENIG+G/F, Flash Gold+G/F, Immersion Silver+G/F, Immersion Tin+G/F |
5 | Solder mask color | Green, Yellow, Black, Matte black, Blue, Red, White,Matte green |
6 | Silkscreen color | White, Yellow, Black |
7 | Max board size (4-10 layers) | 800*600mm |
8 | Min outline tolerance | ±0.03mm(Laser Routing), ±0.1mm(Mechanical Routing) |
9 | Finished Board Thickness | 0.15-5mm |
10 | The tolerance of board thickness | ±0.1mm(thickness≤1.0mm), ±10%mm(thickness>1.0mm) |
11 | Min Drilling hole size | 0.2mm(Mechanical) |
12 | Min hole tolerance | NPTH:±0.025mm PTH: ±0.05mm |
13 | Min Slot hole width/length | 0.5mm/1.0mm |
14 | Min pattern width/spacing | 0.075mm/0.075mm (35um base copper) |
15 | Min pad | 0.15mm |
16 | FR-4 PP | 106, 1080, 3313, 2116, 7628 |
17 | Min inner layer isolation width | 8mil |
18 | Min inner layer isolation ring | 8mil(≤6layer), 10mil(≥8layer) |
19 | Min single side width of inner pad | 4.5(18, 35um, Can be partial 4), 6(70um), 8(105um) |
20 | Impedance tolerance | ±5Ω(<50Ω), ±10%(≥50Ω); |
21 | Min BGA pad diameter | 6mil |
22 | ENIG thickness | Gold:0.025-0.10um Nickel:3-5 um |
23 | Immersion silver.silver thickness | (normal)0.2-0.5um (special)1um |
24 | HASL Lead Free thickness | 2-4um |
25 | Gold Finger:gold/nickel thickness | 0.075-2.5um /3-5um |
26 | Flash Gold:gold thickness | 0.025-0.05um |
27 | Golden finger chamfer Angle tolerance | ±5° |
28 | Immersion tin:Tin thickness | 0.8-1.5um |
29 | Electroplate hard gold thick | 0.075-2.5um |
30 | Min S/M bridge width | 3(green), 5(other color)(base copper≤10Z)(base coppe2-40Z, All in accordance with the 8mil) |
31 | Max diameter of ink plug hole | 0.55mm |
32 | V-CUT Angle specifications | 15°、20°、25°、30° |
33 | Min isolation between carbon and pad | 0.2mm |
34 | Min isolation between carbon and carbon | 0.3mm |
35 | Depth control slot hole ( edge) or Blind slot precision(NPTH) |
±0.10mm |
36 | Min. distance from hole to trace (Not blind/buried holes) | 6(≤8layers), 8(≤14layers), 9(≤20layers) |
37 | Min single-sided width for via hole pad of outer layer | 4(12, 18um)3.5, 4.5(35um), 6(70um), 8(105um), 10(140um) |
38 | Copper stripping strength | 7.8N/cm |