RF PCB CAPABILITY

Common PCB Process capability
No.	Item	Capability
1	Number of layer	1-20
2	Material	Brand: SY, ITEQ, KB, NanYa, NP , GDM, Isola
3	Surface treatment	HASL lead-free, ENIG, OSP, Immersion Tin, Immersion Silver, Plating Gold
4	Selectivity surface treatment	ENIG+OSP, ENIG+G/F, Flash Gold+G/F, Immersion Silver+G/F, Immersion Tin+G/F
5	Solder mask color	Green, Yellow, Black, Matte black, Blue, Red, White,Matte green
6	Silkscreen color	White, Yellow, Black
7	Max board size (4-10 layers)	800*600mm
8	Min outline tolerance	±0.03mm(Laser Routing), ±0.1mm(Mechanical Routing)
9	Finished Board Thickness	0.15-5mm
10	The tolerance of board thickness	±0.1mm(thickness≤1.0mm), ±10%mm(thickness>1.0mm)
11	Min Drilling hole size	0.2mm(Mechanical)
12	Min hole tolerance	NPTH:±0.025mm PTH: ±0.05mm
13	Min Slot hole width/length	0.5mm/1.0mm
14	Min pattern width/spacing	0.075mm/0.075mm (35um base copper)
15	Min pad	0.15mm
16	FR-4 PP	106, 1080, 3313, 2116, 7628
17	Min inner layer isolation width	8mil
18	Min inner layer isolation ring	8mil(≤6layer), 10mil(≥8layer)
19	Min single side width of inner pad	4.5(18, 35um, Can be partial 4), 6(70um), 8(105um)
20	Impedance tolerance	±5Ω(＜50Ω), ±10%(≥50Ω);
21	Min BGA pad diameter	6mil
22	ENIG thickness	Gold：0.025-0.10um Nickel：3-5 um
23	Immersion silver.silver thickness	（normal）0.2-0.5um (special)1um
24	HASL Lead Free thickness	2-4um
25	Gold Finger:gold/nickel thickness	0.075-2.5um /3-5um
26	Flash Gold:gold thickness	0.025-0.05um
27	Golden finger chamfer Angle tolerance	±5°
28	Immersion tin:Tin thickness	0.8-1.5um
29	Electroplate hard gold thick	0.075-2.5um
30	Min S/M bridge width	3(green), 5(other color)(base copper≤10Z)(base coppe2-40Z, All in accordance with the 8mil)
31	Max diameter of ink plug hole	0.55mm
32	V-CUT Angle specifications	15°、20°、25°、30°
33	Min isolation between carbon and pad	0.2mm
34	Min isolation between carbon and carbon	0.3mm
35	Depth control slot hole ( edge) or Blind slot precision(NPTH)	±0.10mm
36	Min. distance from hole to trace (Not blind/buried holes)	6(≤8layers), 8(≤14layers), 9(≤20layers)
37	Min single-sided width for via hole pad of outer layer	4(12, 18um)3.5, 4.5(35um), 6(70um), 8(105um), 10(140um)
38	Copper stripping strength	7.8N/cm

SUNBRIGHT PCB TECHNOLOGY (HK)

Tel:+86-755-29753506 +86-755-81774121
E-mail: sales@sunbrightpcb.com
Headquarters Address:Room 405-406, Building 1, No. 62, Yongnan Road, Shajing Town, Bao'an District, Shenzhen

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